Electroplating hanger deplating solution and its deplating solution method

Application number 201510767546. 4

Application date 2015. 11. 11

Applicant Guangzhou Taihe Circuit Board Co., Ltd.

Address 510540, No. 22, 1st Ring Road, Taihe Town, Baiyun District, Guangzhou City, Guangdong Province

Inventor Yang Xiaohai Wang Jun

Patent Agency Haixin Joint Specialty in Yuexiu District, Guangzhou City

Name of invention A electroplating hanger deplating solution and its method


The present invention discloses a deplating solution for electroplating racks and a deplating solution method thereof; aims to provide an economical, environmentally friendly, and fast copper corrosion rate of electroplating racks deplating solution and a deplating method thereof; its technical points : The electroplating rack deplating solution, each liter of the deplating solution contains the following components: sulfuric acid 50-280ml, hydrogen peroxide 18-80ml, additives 30-100ml, the balance is water; it belongs to the technical field of electroplating solutions

A kind of plating hanging With deplating solution and its method.pdf